Portal:Process Intelligence/Page
ECoat01 pH
ECoat01 Conductivity
CureOven01 Temp PV
Booth03 Humidity
Defect Rate Overall
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Correlation Heatmap
Scatter Plot Matrix (SPLOM)
Top correlations: ECoat01 pH β ECoat01 Conductivity (r = 0.87, expected from bath chemistry); CureOven Z2 PV β Booth03 Humidity (r = β0.72, oven heat drives booth dehumidification). Both are physically plausible and consistent with process models.
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